RENU™ PAI UNC-MP140 is a 140-mesh polyamide-imide powder in the uncured (pre-cure) state. In the uncured condition, PAI is processable at lower temperatures and exhibits higher green strength for compression molding of complex near-net-shape parts. After molding, a staged post-cure cycle completes the imidization reaction, developing the full suite of PAI’s exceptional mechanical, thermal, and tribological properties. This grade is the preferred form for producing custom-shaped PAI compression molded components. Properties listed below reflect fully post-cured values.
PHYSICAL PROPERTIES
Property | Value / Range |
Polymer Type | Polyamide-imide (PAI) — Uncured |
Grade | Uncured (pre-imidized) |
RENU™ Code | RENU™ PAI UNC-MP140 |
Color | Light amber (pre-cure); darkens to dark amber upon full cure |
Mesh Size | 140 mesh (≤ 105 µm) |
Bulk Density (loose) | 0.30–0.45 g/cm³ |
Specific Gravity (fully cured) | 1.40 g/cm³ |
Storage Requirement | Cool, dry, sealed container — limited shelf life at room temp |
THERMAL PROPERTIES
Property | Value |
Tg (fully cured) | 275°C (527°F) |
Continuous Use Temp (fully cured) | 260°C (500°F) |
Cure Onset Temperature | 150–175°C |
Full Cure Temperature (recommended) | 232–260°C for 16–48 hours |
MECHANICAL PROPERTIES
Property | Value (SI) | Value (Imperial) |
Tensile Strength (fully cured) | 152 MPa | 22,000 psi |
Flexural Strength (fully cured) | 220 MPa | 31,900 psi |
Compressive Strength (fully cured) | 172 MPa | 24,900 psi |
Izod Impact (Notched, cured) | 144 J/m | 2.7 ft-lb/in |
CHEMICAL RESISTANCE
Agent / Environment | Resistance Rating |
See TDS-013 | Chemical resistance profile identical to cured PAI — see TDS-013 for full data |
ELECTRICAL PROPERTIES
Property | Value |
Volume Resistivity (cured) | 2 × 10¹⁵ Ω·cm |
Dielectric Strength (cured) | 560 kV/m |
TYPICAL APPLICATIONS
Note: RENU™ recycled powders are suitable for non-critical industrial, electronics, automotive, and commercial applications. They are NOT recommended for safety-critical aerospace structures or life-sustaining medical devices.
Application Area | Specific Uses |
Compression Molding (Near-Net-Shape) | Primary application — uncured PAI provides excellent moldability for complex geometries |
Custom-Profile Seals | Gaskets, seals, and rings molded to specific profiles before cure |
High-Performance Bearings | Bearing blanks molded to near-net shape, then machined after full cure |
PACKAGING & AVAILABILITY
Format | Details |
Box (Standard) | Up to 25 kg (55 lbs) per box — double-wall corrugated with poly liner |
Drum (Bulk) | 68 kg (150 lbs) bulk drums — fiber or plastic drum with sealed poly liner |
Custom Packaging | Available on request for larger volumes — contact PolyClean for details |
Labeling | Each container labeled with: RENU™ product code, mesh size, lot number, and date of manufacture |
Processing Notes IMPORTANT: Uncured PAI has limited shelf life — store refrigerated (4°C) in sealed container to maximize storage stability. Post-cure schedule: 150°C / 2 hr → 177°C / 2 hr → 204°C / 2 hr → 232°C / 16–48 hr. Parts must be machined after full cure for dimensional precision. Do not attempt to melt-process uncured PAI — compression molding only. |
DISCLAIMER The technical data contained in this document has not been produced by PolyClean Technologies through its own independent testing and measurements. This information has been assembled from publicly available data published by original polymer manufacturers and industry reference sources. PolyClean Technologies makes no warranties, expressed or implied, regarding the accuracy or completeness of this information.
Customers are solely responsible for verifying that this material is suitable for their specific application. PolyClean Technologies shall not be liable for any damages resulting from the use of this information or from the use of its products in any application. This data is intended for general guidance only.
RENU™ recycled materials are produced from post-industrial clean scrap and are appropriate for non-critical industrial, commercial, electronics, and general-purpose applications. They are not recommended or warranted for use in flight-critical aerospace structures, implantable medical devices, or other life-safety applications without thorough independent testing and qualification by the end user. |