RENU™ PEEK HF NAT-MP140 is a precision-milled, high-flow grade polyetheretherketone (PEEK) powder produced from clean, post-industrial recycled PEEK scrap. Ambient-temperature milling preserves the polymer’s molecular architecture, delivering thermal and mechanical properties that closely match virgin resin at substantially reduced cost. The 140-mesh cut (nominal 105 µm top size) is optimized for powder coating, selective laser sintering (SLS), compression molding, and thermal spray applications. The high-flow (HF) designation indicates this grade is derived from higher-viscosity PEEK feedstock milled to produce a freely-flowing powder suitable for broad industrial processing.
PHYSICAL PROPERTIES
Property | Value / Range |
Polymer Type | Polyetheretherketone (PEEK) |
Flow Grade | High Flow (HF) |
RENU™ Code | RENU™ PEEK HF NAT-MP140 |
Color | Natural (off-white to light tan) |
Mesh Size (US Standard Sieve) | 140 mesh |
Nominal Top Particle Size | ≤ 105 µm (microns) |
D50 Particle Size (typical) | 40–65 µm |
Particle Shape | Irregular (ambient milled) |
Bulk Density (loose) | 0.45–0.60 g/cm³ |
Apparent / Tap Density | 0.65–0.80 g/cm³ |
Moisture Content | < 0.05% (as-shipped) |
Recyclability | Post-industrial recycled content |
THERMAL PROPERTIES
Property | Value |
Glass Transition Temperature (Tg) | 143°C (289°F) |
Melting Point (Tm) | 343°C (649°F) |
Continuous Use Temperature | 250°C (482°F) |
Short-Term Peak Temperature | 310°C (590°F) |
Thermal Conductivity | 0.25 W/m·K |
Coefficient of Thermal Expansion (CTE) | 47 × 10⁻⁶ /°C |
Specific Heat Capacity | 0.32 cal/g·°C |
Heat Deflection Temperature (1.8 MPa) | 152°C (306°F) |
MECHANICAL PROPERTIES
Property | Value (SI) | Value (Imperial) |
Tensile Strength | 100 MPa | 14,500 psi |
Tensile Modulus (Young’s Modulus) | 3,600 MPa | 522,000 psi |
Elongation at Break | 30–50% | 30–50% |
Flexural Strength | 165 MPa | 24,000 psi |
Flexural Modulus | 3,700 MPa | 537,000 psi |
Compressive Strength | 120 MPa | 17,400 psi |
Izod Impact Strength (Notched) | 85 J/m | 1.6 ft-lb/in |
Hardness | Rockwell M99 | Rockwell R123 |
Coefficient of Friction (dry, vs steel) | 0.35–0.40 | 0.35–0.40 |
CHEMICAL RESISTANCE
Agent / Environment | Resistance Rating |
Strong Mineral Acids (H₂SO₄, HCl, HNO₃) | Good — consult for concentrated applications |
Weak Acids | Excellent |
Strong Alkalis / Bases | Good |
Weak Alkalis / Bases | Excellent |
Aliphatic Hydrocarbons | Excellent |
Aromatic Hydrocarbons | Excellent |
Halogenated Solvents | Excellent |
Ketones & Esters | Excellent |
Alcohols | Excellent |
Hot Water / Steam (to 200°C) | Excellent |
Fuels & Oils | Excellent |
Water Absorption (24 hr, ASTM D570) | < 0.5% |
ELECTRICAL PROPERTIES
Property | Value |
Dielectric Strength | 190 kV/m |
Dielectric Constant (1 MHz) | 3.2 |
Dissipation Factor (1 MHz) | 0.003 |
Volume Resistivity | > 10¹⁶ Ω·cm |
Surface Resistivity | > 10¹⁵ Ω/sq |
TYPICAL APPLICATIONS
Note: RENU™ recycled powders are suitable for non-critical industrial, electronics, automotive, and commercial applications. They are NOT recommended for safety-critical aerospace structures or life-sustaining medical devices.
Application Area | Specific Uses |
Powder Coating | Electrostatic and fluidized-bed powder coating of metal components for chemical resistance and high-temp service |
Additive Manufacturing (SLS/LS) | Selective laser sintering of functional prototypes and production parts for industrial and electronics applications |
Compression Molding | Near-net-shape production of seals, bushings, thrust washers, and valve components |
Thermal Spray | PEEK thermal spray coatings for anti-corrosion and electrical insulation on metal substrates |
Non-Critical Aerospace (structural) | Interior brackets, spacers, and non-load-bearing components where elevated temperature performance is required |
Non-Critical Medical Devices | Housings, enclosures, and non-implantable components requiring chemical resistance and sterilizability |
Electronics / Semiconductor | Wafer carriers, sockets, test fixtures, and insulators requiring high purity and dimensional stability |
Automotive | High-temp under-hood components, sensors, connectors, and fuel system parts |
PACKAGING & AVAILABILITY
Format | Details |
Box (Standard) | Up to 25 kg (55 lbs) per box — double-wall corrugated with poly liner |
Drum (Bulk) | 68 kg (150 lbs) bulk drums — fiber or plastic drum with sealed poly liner |
Custom Packaging | Available on request for larger volumes — contact PolyClean for details |
Labeling | Each container labeled with: RENU™ product code, mesh size, lot number, and date of manufacture |
Processing Notes Recommend drying at 150°C for 3–4 hours before processing to remove absorbed moisture. Melt processing: typical processing temperature range 360–400°C; avoid sustained exposure above 400°C to prevent degradation. For SLS applications, bed temperature is typically set 5–15°C below Tg (approximately 130–138°C). Contact PolyClean for custom mesh sizes (20–170 mesh range available). |
DISCLAIMER The technical data contained in this document has not been produced by PolyClean Technologies through its own independent testing and measurements. This information has been assembled from publicly available data published by original polymer manufacturers and industry reference sources. PolyClean Technologies makes no warranties, expressed or implied, regarding the accuracy or completeness of this information.
Customers are solely responsible for verifying that this material is suitable for their specific application. PolyClean Technologies shall not be liable for any damages resulting from the use of this information or from the use of its products in any application. This data is intended for general guidance only.
RENU™ recycled materials are produced from post-industrial clean scrap and are appropriate for non-critical industrial, commercial, electronics, and general-purpose applications. They are not recommended or warranted for use in flight-critical aerospace structures, implantable medical devices, or other life-safety applications without thorough independent testing and qualification by the end user. |